=== Packages ===

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2152 Hybrid module packages and microcircuit (TO, DIP, flatpack, plug-in), F <115 GHz
2516 Hybrid housing, are used to install RF circuits. Each housing consists of the bottom section and the cover, opening for connector locations can easily be fitted when needed
2801 Packages (Extender cards, 19" full - and chassis racks, 19" rackase system, insert modules for Eurocards, 19" subracks, 19" subrack for EMC applications, 19" PC casing, 19" monitor casing, desk casing, combination casing mode of celuminium profiles and front panels, shell casing, casing for high frequency techology sheet material constructions, front panels)
4696 Metal packages (standard industry sizes and outlines, thermal solutions, lead grounding, custom plating, lead forming)
4697 Surface mount packages (ceramic and glass-to-metal, standard outlines, lead grounding, custom plating, lead forming)
4698 Microwave & custom machined packages (50 Ohm impedance, lead grounding, custom plating, standard SMA, GPO, etc. systems, quick prototype deliveries)
4699 High power packages (glass or ceramic insulators, thermal base plates, utilization of new materials, custom plating, lead grounding)
9999 Housing, precision, RF & MW. The range has been planned to coincide with popular diecast box sizes but with depths more suited to RF microwave, stripline circuitry & SMC. A silicon nickel gasket in machined groove reduces RF leakage to –150 dB typ. Sizer = 35 x 89 x 30 mm, 35 x 114 x 30 mm, 64 x 114 x 30 mm, 89 x 114 x 30 mm, 100 x 140 x 30 mm, 146 x 222 x 30 mm
20499 Ceramic ball grid packages, thin film, MMIC, low costtrue surface mount configuration, quick prototyping (typically 8 weeks), being BGA, smallest possible foot print, excellent CTE match with GaAs, excellent heat dissipation, flip-chip compatible, for high frequency commercial broadband wireless applications such as LMDS and satellite communication. Package material: 99.6% alumina or aluminum nitride, balls: Cu/Ag brazed to ceramic, nickel/gold plated, I/Os: 3RF & 5DC, 2RF & 8DC, 2RF & 6DC, die side metallization: Ti, Ni, and Au (wirebondable), thermal dissipation: 2W with 2 mm^2 die for Tj<145°C@Ta=45°C, ball shear strength: >1 kg, lid-optional: pressed ceramic lid with epoxy preform
23441 Casings, miniature aluminium, casing tubes made of aluminium sections which are slotted into each other and screwed together, the tubes from a guide groove in the center for supporting a printed circuit board or installation plate with a thickness of 1.5 to 1.6 mm, while using the corresponding case D-sub connectors can be mounted without front panel. Available lengths=50, 80, 100 mm, widths=29, 33, 41.3, 55, 69, 71.5 mm, heights=16, 20, 24 mm
23442 Casings, miniature, aluminium, combination case with inner guide rails used to mount 100 mm Eurocards, casing tube made of aluminium sections which are slotted into each other and screwed together, with M3 fixing threads for cover panels. Available lengths=80, 100, 120, 160, 200, 220 mm, width=105 mm, heights=22, 26, 30, 34, 38, 46 mm
23443 Casings, miniature, aluminium, with integrated cooling fins, casing tubes made of aluminium sections which are slotted into each other and screwed together, the tubes from a guide groove in the center for supporting a printed circuit board or installation plate with a thickness of 1.5 to 1.6 mm, and a width of 44 mm, D-Sub connectors, 25-way, can be mounted, cutoffs, special lengths, clear anodized surface finish. Available lengths=50, 80, 100 mm
23624 Enclosures, have shielding capabilities to 60 dB at 3 GHz, independent access from either side
23625 Enclosures, provide up to 100 dB shielding effectiveness at 100 MHz, easy access and assembly, off-the-shelf availability
23626 Enclosures, shielding at or above 80 dB, tested to 20 GHz, provides atmospheric seals, gas tight seals attainable with higher clamping forces, independent access from either side


  
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